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Thin plate bending substrate

Thin plate bending substrate

Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.

The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used only for several bends or during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between other substrates, all suitable for multiple bends. Please feel free to contact us when you need assistance. 【Specifications (Partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

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[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps keep initial costs low from prototyping to mass production, allowing for inexpensive product manufacturing. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 ■ Ideal for applications that require several bending actions during bending and assembly ■ More cost-effective for products and initial costs compared to flexible circuit boards (compared to our offerings) ■ No need for coverlay processing molds or outline processing molds ■ Capable of handling small to medium production volumes *For more details, please refer to the documentation. Feel free to contact us with any inquiries. *Documentation for special circuit boards other than thin plate bending circuit boards is also available for download.

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